Our client is a global leader in design, manufacturing, and supply chain solutions for advanced technology products, including AI servers, networking, and storage. They are seeking an SMT Process Engineering Manager to join their Core Engineering (advanced manufacturing) team. This hands-on role drives process characterisation and new technology development for large-BGA, high-complexity server boards, from early development through to NPI.
Key Responsibilities
- Characterise PCB and BGA warpage and optimise reflow profiles for large, high-thermal-mass boards
- Design and optimise stencils, and review and finalise custom pick-and-place nozzle designs
- Review and validate process and tooling requirements, and provide hands-on support for process builds
- Evaluate NUDD (New, Unique, Different, Difficult) processes, golden pFMEA, and CTQ parameters against product technology requirements
- Prepare engineering reports based on product features and failure analysis results
- Lead weekly internal and external meetings with customers and suppliers, including phase exit reviews
- Support RFQs with cost estimates for NUDD processes
- Drive technology development for large BGAs ahead of or in parallel with NPI
Requirements
- Bachelor’s degree or above in Engineering, such as Electronics, Materials, Manufacturing, or a related field
- Extensive hands-on SMT process engineering experience in EMS or electronics manufacturing, ideally on server, networking, or other complex, high-layer-count boards
- Deep knowledge of solder materials, PCB materials, and surface finishes including OSP, ENIG, and ENEPIG, with proven DOE-based material qualification
- Expert-level knowledge of SMT equipment including printers, SPI, placement, reflow, and AOI and AXI, covering configuration and capability
- Strong experience with warpage characterisation, reflow profiling, and stencil design
- NPI and customer-facing project experience, with knowledge of pFMEA, CTQ, and failure analysis methodology
- Strong English communication skills
