Responsibilities
- Hands-on package design for new products, including substrate and layout design, particularly in Flip-Chip, Power Packaging, and/or SMT
- Run design simulations (e.g. thermal, mechanical, electrical) to validate package performance before build
- Define package architecture, materials, and process flows with design-for-manufacturability (DFM) in mind
- Drive NPI activities from design through qualification and production ramp, ensuring new packages meet quality and reliability requirements
- Plan, run, and analyze design and process experiments DOE) to optimize performance, yield, and process stability
- Lead design reviews and technical discussions with customers, and translate their requirements into package specifications
- Partner with assembly and test operations to resolve manufacturing issues and feed lessons back into design
- Identify and implement design and process improvements that raise efficiency and product quality
- Lead, coach, and develop the packaging engineering team while staying close to the technical work
- Bachelor’s degree in Engineering (Electrical, Electronics, Materials, or related field), Science, or equivalent
- Minimum 8 years in semiconductor packaging and manufacturing, with hands-on experience in Flip-Chip, Power Packaging, and/or SMT
- Proven hands-on package design experience (substrate/layout design and simulation tools), plus NPI, DFM, and qualification/reliability testing
- Solid knowledge of semiconductor packaging and assembly processes
- Leadership and team management experience across cross-functional engineering and production teams
- Strong data analysis and statistical skills (DOE, yield analysis, SPC), plus strong reporting ability
- Strong English communication, verbal and written, including comfort presenting to customers
