Packaging Design Engineering Manager

1003942

Location
Phra Nakhon Si Ayutthaya
Salary
THB70000 - THB90000 per month

Expertise and Skill Tags

Our client is an established semiconductor manufacturer specializing in advanced packaging and assembly technologies. They deliver high-quality manufacturing solutions for the global electronics and semiconductor markets. The Packaging Design Engineering Manager is a hands-on technical leader who owns package design and new product introduction (NPI) across Flip-Chip, Power Packaging, and/or SMT platforms. You will take new products from package concept through design, qualification, and production ramp, working closely with assembly, test, and customers to deliver packages that are manufacturable, reliable, and high-yielding.

Responsibilities
  • Hands-on package design for new products, including substrate and layout design, particularly in Flip-Chip, Power Packaging, and/or SMT
  • Run design simulations (e.g. thermal, mechanical, electrical) to validate package performance before build
  • Define package architecture, materials, and process flows with design-for-manufacturability (DFM) in mind
  • Drive NPI activities from design through qualification and production ramp, ensuring new packages meet quality and reliability requirements
  • Plan, run, and analyze design and process experiments DOE) to optimize performance, yield, and process stability
  • Lead design reviews and technical discussions with customers, and translate their requirements into package specifications
  • Partner with assembly and test operations to resolve manufacturing issues and feed lessons back into design
  • Identify and implement design and process improvements that raise efficiency and product quality
  • Lead, coach, and develop the packaging engineering team while staying close to the technical work
Qualifications
  • Bachelor’s degree in Engineering (Electrical, Electronics, Materials, or related field), Science, or equivalent
  • Minimum 8 years in semiconductor packaging and manufacturing, with hands-on experience in Flip-Chip, Power Packaging, and/or SMT
  • Proven hands-on package design experience (substrate/layout design and simulation tools), plus NPI, DFM, and qualification/reliability testing
  • Solid knowledge of semiconductor packaging and assembly processes
  • Leadership and team management experience across cross-functional engineering and production teams
  • Strong data analysis and statistical skills (DOE, yield analysis, SPC), plus strong reporting ability
  • Strong English communication, verbal and written, including comfort presenting to customers

More jobs
Packaging Design Engineering Manager
Our client is an established semiconductor manufacturer specializing in advanced packaging and assembly technologies. They deliver high-quality manufacturing solutions for the global electronics and semiconductor markets. The Packaging Design Engineering Manager is a hands-on technical leader who owns package design and new product introduction (NPI) across Flip-Chip, Power Packaging, and/or SMT platforms. You will take new products from package concept through design, qualification, and production ramp, working closely with assembly, test, and customers to deliver packages that are manufacturable, reliable, and high-yielding.

Responsibilities
  • Hands-on package design for new products, including substrate and layout design, particularly in Flip-Chip, Power Packaging, and/or SMT
  • Run design simulations (e.g. thermal, mechanical, electrical) to validate package performance before build
  • Define package architecture, materials, and process flows with design-for-manufacturability (DFM) in mind
  • Drive NPI activities from design through qualification and production ramp, ensuring new packages meet quality and reliability requirements
  • Plan, run, and analyze design and process experiments DOE) to optimize performance, yield, and process stability
  • Lead design reviews and technical discussions with customers, and translate their requirements into package specifications
  • Partner with assembly and test operations to resolve manufacturing issues and feed lessons back into design
  • Identify and implement design and process improvements that raise efficiency and product quality
  • Lead, coach, and develop the packaging engineering team while staying close to the technical work
Qualifications
  • Bachelor’s degree in Engineering (Electrical, Electronics, Materials, or related field), Science, or equivalent
  • Minimum 8 years in semiconductor packaging and manufacturing, with hands-on experience in Flip-Chip, Power Packaging, and/or SMT
  • Proven hands-on package design experience (substrate/layout design and simulation tools), plus NPI, DFM, and qualification/reliability testing
  • Solid knowledge of semiconductor packaging and assembly processes
  • Leadership and team management experience across cross-functional engineering and production teams
  • Strong data analysis and statistical skills (DOE, yield analysis, SPC), plus strong reporting ability
  • Strong English communication, verbal and written, including comfort presenting to customers
Flagship/Power Packaging/SMT Engineering Manager
Our client is an established international semiconductor manufacturer specializing in advanced packaging and assembly solutions. They are strengthening their capabilities in advanced packaging technologies and driving continuous improvement across production.Lead the engineering team responsible for new product development, NPI, and process improvement in semiconductor packaging.

Responsibilities
  • Lead and develop the engineering team, setting priorities and ensuring delivery of development and NPI projects
  • Own NPI end to end: process development, qualification, and ramp into mass production
  • Lead new product development within your core technology area: flip-chip, power packaging, or SMT
  • Drive yield, quality, and efficiency improvements using DOE, statistical analysis, and structured problem solving
  • Partner with assembly, production, test, and quality to resolve process issues, yield loss, and quality concerns
  • Define and track engineering KPIs to ensure process stability and manufacturing effectiveness
  • Ensure new products and processes meet technical, quality, and production requirements

Qualifications
  • Bachelor’s degree or higher in Electrical/Electronics Engineering, Materials Science, Physics, or a related technical field
  • 8+ years in semiconductor manufacturing, with hands-on expertise in at least one of the following (required): flip-chip, power packaging and SMT
  • Exposure to more than one is a plus.
  • 7+ years leading engineers or technical teams
  • Proven track record in NPD, NPI, and process qualification
  • Strong command of DOE, statistics, and root-cause analysis
  • Strong project management and technical decision-making
  • Good English for presentations and technical reporting
Manufacturing
HR Manager

Our client is a well-established regional manufacturing organisation with operations across Thailand, Vietnam, and Hong Kong, serving international markets. As part of its continued growth, the Group is seeking an experienced HR Manager to lead its centralised HR, General Affairs, Employee Well-being, Environment, and Compliance functions. Based in Bangkok, this senior leadership role works closely with senior management and stakeholders across multiple countries to support the Group’s people and business objectives.


Key Responsibilities

  • Develop and implement HR strategies, policies, and initiatives aligned with business objectives
  • Provide HR leadership and advice to senior management across the Group
  • Oversee the full spectrum of HR operations including recruitment, performance management, compensation and benefits, training, and employee relations
  • Manage HR administration and continuously improve HR processes and systems
  • Drive employee engagement, well-being, and retention initiatives across the organisation
  • Ensure compliance with Thai Labour Law, regulations, and company policies
  • Manage HR audits, documentation, and compliance requirements
  • Oversee General Affairs, facilities, and employee services
  • Promote a safe, positive, and efficient working environment, including environmental initiatives
  • Provide HR reports and insights to support management decision-making
  • Lead HR projects and continuous improvement initiatives across the Group

Requirements

  • Bachelor’s degree or higher in Human Resources, Business Administration, or a related field
  • Minimum 8 years of HR experience with proven experience in a managerial or leadership role
  • Experience in a manufacturing environment is highly preferred
  • Strong knowledge of Thai Labour Law and HR best practices
  • Experience in Social, Labour, Health, Safety, and Environmental audits including SLCP, HIGG FEMM, and SEDEX SMETA
  • Strong leadership, communication, problem-solving, and stakeholder management skills
  • Good command of English, both written and spoken